WLP+ASIC Uncooled Thermal Modules
COIN series uncooled thermal module integrates the wafer-level package detector produced by GST, ASIC chip for imaging processing, micro-motion electromagnetic threshold shutter and general optical interface. It is beneficial to OEM customers for secondary development and suitable for the development and integration of thermal imager in various applications.
17μm Pixel Pitch
＜3s Start-up Time
COIN417 integrates 400x300@17μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm.
The COIN417 infrared module features in sharp and crisp thermal image presentation, compact size and low cost. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.
Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for COIN series thermal imaging common module to be integrated into more terminal products and greatly reduces the cost for customers.
ADD TO COMPARE
|IR Detector Performance|
|Dimming||Linear/Histogram/Mixed three modes|
|Digital zoom||1~8X continual zoom，step size 1/8|
|Image display||Black hot/White hot/Pseudo color|
|Image direction||Horizontally/Vertically/Diagonally Flip|
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