COIN417/R

WLP+ASIC Uncooled Thermal Modules

COIN series uncooled thermal module integrates the wafer-level package detector produced by GST, ASIC chip for imaging processing, micro-motion electromagnetic threshold shutter and general optical interface. It is beneficial to OEM customers for secondary development and suitable for the development and integration of thermal imager in various applications.


400x300IR resolution

17μm Pixel Pitch

<3s Start-up Time

<40mK NETD

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COIN417 integrates 400x300@17μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm.


The COIN417 infrared module features in sharp and crisp thermal image presentation, compact size and low cost. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement. 

 

Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for COIN series thermal imaging common module to be integrated into more terminal products and greatly reduces the cost for customers.





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Technical Parameters

Model

COIN417/R

ADD TO COMPARE

IR Detector Performance
Resolution 400X300@12μm
Spectral response 8~14μm
NETD <40mk
Image Processing
Frame rate 9Hz/25Hz/30Hz/50Hz/60Hz
Start-up time <3秒
Analog video PAL/NTSC
Digital video Y16/YUV/BT656
Dimming Linear/Histogram/Mixed three modes
Digital zoom 1~8X continual zoom,step size 1/8
Image display Black hot/White hot/Pseudo color
Image direction Horizontally/Vertically/Diagonally Flip
Image algorithm NUC,AGC,IDE,DNR

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