COIN612/R

WLP+ASIC Uncooled Thermal Modules

COIN series uncooled thermal module integrates the wafer-level package detector produced by GST, ASIC chip for imaging processing, micro-motion electromagnetic threshold shutter and general optical interface. It is beneficial to OEM customers for secondary development and suitable for the development and integration of thermal imager in various applications.


640x512IR resolution

12μmPixel Pitch

<3s Start-up Time

<40mKNETD

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COIN612 integrates 640x512@12μm wafer level package (WLP) infrared thermal detector, high performance signal processing circuit and image processing algorithm.


The COIN612 infrared camera core features in sharp and crisp image presentation, compact size and low cost. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement. 

 

Its lightweight and flexible features with various industry standard interfaces make it beneficial to OEM customers for secondary development and integration in all kinds of infrared thermal cameras.

 

Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for COIN series to be integrated into more terminal products and greatly reduces the cost for customers.





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Technical Parameters

Model

COIN612/R

ADD TO COMPARE

IR Detector Performance
Resolution 640X512@12μm
Spectral response 8~14μm
NETD <40mk
Image Processing
Frame rate 9Hz/25Hz/30Hz/50Hz/60Hz
Start-up time <3秒
Analog video PAL/NTSC
Digital video Y16/YUV/BT656
Dimming Linear/Histogram/Mixed three modes
Digital zoom 1~8X continual zoom,step size 1/8
Image display Black hot/White hot/Pseudo color
Image direction Horizontally/Vertically/Diagonally Flip
Image algorithm NUC,AGC,IDE,DNR

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