Guide TIMO Series Thermal Imaging Module
Guide TIMO Series Thermal Imaging Module
Boost Infrared Application of Consumer Electronics Market
Application field: ThermographyIndustrial processInspection and quarantineMedical DiagnosisSmart home
The wafer-level package infrared module integrates wafer-level optical lens, wafer-level package detector, and basic imaging processing circuit to achieve accurate temperature data and sharp images for each pixel in the full frame, enabling easy integration into mobile terminals or smart devices, especially innovative products with strict requirements on cost, size and weight.

TIMO Thermal Imaging Module (2).jpg



Model

120 Module(50°)

120 Module(120°)

Performance Parameter

Sensor type

VOx Microbolometer

Resolution

120X90

Pixel Pitch

17μm

Spectral Range

LWIR, 8~14μm

NETD

<60mK

Optics Type

Wafer-level Optics

Focus

Fixed

HFOV

50°

120°

Depth of Field

10cm to infinity

Frame Rate

1-30Hz(Controllable)

Output Format

Raw14

Output Format

Nonuniformity

Temperature range

-20°C~ +120°C (standard)

Temperature range can be extended to 400°C

Interface/Control

AVDD

3.6V±0.05V

VSK

4.7V

DVDD

1.8V±0.05V

Interface

Digital Interface

Power consumption

45mw (Typical Value), 9mw (Low Power Mode)

Physical Characteristics

Dimension(mm)

8.5X8.5X9.16

8.5X8.5X5.5

Operation Temperature

-20°C~ +60°C

Storage Temperature

-40°C~ +85°C

Humidity

<85%RH



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