TIMO256-x0
Thermal Imaging Module
The wafer-level package infrared module integrates wafer-level optical lens, wafer-level package detector, and basic imaging processing circuit to achieve accurate temperature data and sharp images for each pixel in the full frame, enabling easy integration into mobile terminals or smart devices, especially innovative products with strict requirements on cost, size and weight.
256x192IR resolution
50mKNETD
56°FOV
15×13×6.95Size（mm）
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Boost Infrared Application of Consumer Electronics Market
Low cost, fast integration
•Minimum WLP infrared module
•DVP Interface, compatible with various embedded platforms
•Visible camera module equivalent, directly integration
•Complete SDK development kit
Extend longer operating time
•Low-power design, lowest to 10mW
Applications
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Technical Parameters
Model
TIMO256-x0
ADD TO COMPARE
| Imaging and optics | ||||
|---|---|---|---|---|
| Detector type | WLP VOx | |||
| Infrared resolution | 256 × 192 | |||
| Pixel Pitch | 12 μm | |||
| Wavelength range | 8 to 14 μm | |||
| Field angle | 56°±1° | |||
| NETD | ≤50 mK | |||
| Infrared frame rate | 25 Hz (Customizable, 1-30 Hz) | |||
| Focusing mode | Focus-free | |||
| Measurement and analysis | ||||
|---|---|---|---|---|
| Measurement range | Industrial measurement: -20°C to 150°C, 100°C to 550°C (automatic switching) ; Human body：20 °C to 50 °C (accurate temperature measuring range: 28-40°C) | |||
| Measurement accuracy | Industrial measurement：±2°C or ±2%, whichever is greater; Human body：±0.5°C | |||
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