TIMO256

Thermal Imaging Module

The wafer-level package infrared module integrates wafer-level optical lens, wafer-level package detector, and basic imaging processing circuit to achieve accurate temperature data and sharp images for each pixel in the full frame, enabling easy integration into mobile terminals or smart devices, especially innovative products with strict requirements on cost, size and weight.


256x192IR resolution

50mKNETD

56°FOV

15×13×6.95Size(mm)

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Boost Infrared Application of Consumer Electronics Market

Low cost, fast integration

•Minimum WLP infrared module

•DVP Interface, compatible with various embedded platforms

•Visible camera module equivalent, directly integration

•Complete SDK development kit




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Extend longer operating time

•Low-power design, lowest to 10mW


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Media Gallery

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Technical Parameters

Model

TIMO256

ADD TO COMPARE

Imaging and optics
Detector type WLP VOx
Infrared resolution 256 × 192
Pixel Pitch 12 μm
Wavelength range 8 to 14 μm
Field angle 56°±1°
NETD ≤50 mK
Infrared frame rate 25 Hz (Customizable, 1-30 Hz)
Focusing mode Focus-free
Measurement and analysis
Measurement range Industrial measurement: -20°C to 150°C, 100°C to 550°C (automatic switching) ; Human body:20 ℃ to 50 ℃ (accurate temperature measuring range: 28-40℃)
Measurement accuracy Industrial measurement:±2°C or ±2%, whichever is greater; Human body:±0.5℃

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