COIN212/R

WLP+ASIC Uncooled Thermal Modules

COIN series uncooled thermal module integrates the wafer-level package detector produced by GST, ASIC chip for imaging processing, micro-motion electromagnetic threshold shutter and general optical interface. It is beneficial to OEM customers for secondary development and suitable for the development and integration of thermal imager in various applications.


256x192IR resolution

12μm Pixel Pitch

<3sStart-up Time

<40mKNETD

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COIN212 integrates 256x192@12μm wafer level package (WLP) uncooled VOx infrared detector, high performance signal processing circuit and image processing algorithm. It has an optional thermographic function with measurement range from -20℃~150 ℃ for industrial or body temperature measurement. 
 
Its lightweight and flexible features with various industry standard interfaces make this small infrared camera module beneficial to OEM customers for secondary development and integration in all kinds of thermal imagers and infrared thermographic cameras.
 
Until now, we have provided our customers with various mature and stable infrared thermal module integration solutions. It’s easier for COIN series infrared thermal camera module to be integrated into more terminal products and greatly reduces the cost for customers.




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Media Gallery

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Technical Parameters

Model

COIN212/R

ADD TO COMPARE

IR Detector Performance
Resolution 256X192@12μm
Spectral response 8~14μm
NETD <40mk
Image Processing
Frame rate 9Hz/25Hz/30Hz/50Hz/60Hz
Start-up time <3秒
Analog video PAL/NTSC
Digital video Y16/YUV/BT656
Dimming Linear/Histogram/Mixed three modes
Digital zoom 1~8X continual zoom,step size 1/8
Image display Black hot/White hot/Pseudo color
Image direction Horizontally/Vertically/Diagonally Flip
Image algorithm NUC,AGC,IDE,DNR

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